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Japan’s Kyocera to invest $9.8 bln for chips over FY2023-2025 -Nikkei

A logo sits illuminated at the Kyocera Corp. pavilion on day three of the Mobile World Congress in Barcelona, Spain, on Wednesday, Feb. 26, 2014. Top telecommunication managers will rub shoulders in Barcelona this week at the Mobile World Congress, Monday, Feb. 24 - 27, a traditional venue for showcasing the latest products for dealmaking. Photographer: Angel Navarrete/Bloomberg

Japan’s Kyocera Corp (6971.T) plans to invest 1.3 trillion yen ($9.77 billion) for manufacturing facilities and development of semiconductor-related products over three years starting in the 2023/24 business year, the Nikkei daily reported on Tuesday.

To fund the expansion for parts such as ceramics for chip-making equipment, Kyocera is looking to borrow up to around 1 trillion yen, using its 15% stake in KDDI Corp (9433.T) as collateral, the president Hideo Tanimoto told Nikkei in an interview.